IBM (International Business Machines Corporation) is among the world's largest companies and a leading brand in information technology. Founded in 1911, it is headquartered in Armonk in the United States and has operations in more than 170 countries. 

IBM's mission has always been to develop advanced information technologies and integrate them into solutions that support innovation in businesses, institutions and society. With five Nobel Prizes awarded to its researchers, IBM holds records in every area of IT and dedicates more than 3,000 people to research alone and annual investments of more than $6 billion; for 21 years it has been the leading company in the United States in terms of number of patents. 

IBM offers a wide range of technological solutions and consulting services, a portfolio of middleware for collaboration, predictive analysis, software development and systems management, as well as the most advanced components (servers, memories, supercomputers) for building the digital infrastructures of the future. Thanks to the experience gained from its activities in consulting, technology and research, IBM is able to accompany clients along the path of transformation brought about by the growing digital interconnection of the economy and society. 
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IBM, a global technology leader in AI and quantum computing. We seek a regular contract Semiconductor Packaging Engineer with an associate or bachelor's degree and expertise in wet clean processing and thermo-compression bonding. You will collaborate on wafer-scale fabrication and process improvements. IBM offers comprehensive healthcare, financial benefits, paid leave, training, and inclusive employee programs.

Semiconductor Packaging Engineer

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