Senior Staff Engineer Package Technology Development

Drive technology integration for semiconductor packaging, focusing on process interaction, risk assessment and new chip technology integration.

Your role

Key responsibilities in your new role

• Drive Technology Integration activities to ensure the package fulfills requirements in terms of process interaction.

• Perform PBC and TPC assessments and drive Package Technology DFMEA.

• Own Risk Interaction assessment and mitigation work packages.

• Drive pre-development for new chip technology.

• Integrate unit processes (BOM and Process) and new chip technology into the package platform, including risk assessment, process interaction studies, and process flow.

• Provide technical guidance and assistance to projects as needed.

• Drive 8D/problem solving for interaction issues.

• Work closely with FE on FE/BE interaction and integration topics.

• Assess the impact of design rules on inter-process interaction.

Your profile

Qualifications and skills to help you succeed

• Minimum Bachelor’s Degree in Engineering, such as Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics or Physics.

• At least 7 years of relevant working experience in an IC/semiconductor environment.

• Strong knowledge of FE/BE interaction and BE/BE interaction.

• Experience with 8D & T6s methodology.

• Knowledge of DFMEA/PFMEA.

• Knowledge of internal package analysis and first-level reliability.

• Strong assembly process knowledge and understanding of surface properties.

• Experience with DOE & Comparative method.

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