Senior Staff Engineer Package Technology Development

Define and develop semiconductor packages from concept to realization, driving package design, technology, cost and innovation for new products

Your role

Key responsibilities in your new role

• Drive technical definition for package projects with major changes or new packages, including BOM, package design, assembly technology, PRP review and project classification.

• Generate conceptual package outlines and internal construction drawings, finalize and document drawings, and update package drawings as needed.

• Define package characteristics to meet electrical, thermal, reliability and mechanical requirements.

• Coordinate Package Cost Estimation and Cost Indication.

• Act as the contact partner for package definition, particularly on Back-End assembly technology know-how.

• Support pre-development and project definition and continue as the package design expert throughout the project phase.

• Actively scout for new packaging technologies and keep up with package development at competitors and subcontractors.

• Serve as the main contact for questions and discussions regarding packaging, package design and package roadmap.

• Drive innovation and pre-development activities within the package platform.

Your profile

Qualifications and skills to help you succeed

• Minimum Bachelor’s Degree in Engineering, such as Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics or Physics.

• At least 7 years of relevant working experience in an IC/semiconductor environment.

• Strong knowledge of Semiconductor Packaging, Assembly and Test.

• Knowledge of Process and Equipment Engineering.

• Knowledge of Failure Analysis and Reliability Engineering.

• Strong analytical and problem-solving skills.

• AutoCAD and 3D drafting knowledge is preferred

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