Senior Engineer UPD Laser Marking and Singulation

#WeAreIn for jobs that impact everyone's life. Join the thinkers, builders, and problem-solvers behind tomorrow’s technology. As a Senior Engineer UPD Laser Marking and Singulation, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life. Are you in?

Your role

Key responsibilities in your new role

In this role, you strive to serve as the primary technical expert in package singulation technology, driving the development of next-generation semiconductor packaging solutions that are high-performing, cost-effective, and scalable for manufacturing.

• Perform Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost competitiveness and manufacturability

• Drive qualification and implement for Tape-based singulation processes, Tapeless singulation solutions, Laser marking & singulation technologies, and Hybrid singulation approaches

• Responsible or support for technical handshake and knowledge transfer to Operations

• Generate and update relevant documents, (e.g. Process Specification, PFMEA, DFMEA, Master FMEA, OJTI, T32, PDR)

• Support prototype and development samples build

• Evaluate emerging singulation technologies and establish technology readiness for industrial deployment

• Provide inputs for updating of related documents and is responsible for their correct contents, (e.g. Process of Record, Assembly Design Rule, Process Roadmap, Failure catalogue, Control Plan, Maintenance checklist, Unit process roadmap for development projects)

• Liaise with suppliers for continuous improvement and perform verification and qualification activities for new tooling, machines and materials in Development projects

• Identify and develop new Process technology and improve Process capability to meet new requirements from Business divisions

• Benchmark industry best practices and identify opportunities for competitive advantage

• Provide technical guidance/buddy to other engineers and project team

Your profile

Qualifications and skills to help you succeed

You strive to leverage deep expertise in package singulation, laser marking, and semiconductor package development to drive innovative, scalable, and cost-effective manufacturing solutions while supporting high-volume production environments. You demonstrate strong technical leadership, strategic thinking, and problem-solving capabilities, influencing stakeholders and advancing process industrialization, yield improvement, and technology roadmap execution across diverse singulation technologies.

• Masters/Bachelor's Degree in Engineering or relevant course with a minimum 10+ years experience in semiconductor backend assembly and package development

• Minimum 5+ years direct experience in package singulation & laser marking process development

• Proven hands-on expertise in Tape-based singulation, Tapeless singulation, Laser marking and singulation

• Experience supporting high-volume semiconductor manufacturing environments

• Demonstrated track record in process development, industrialization, and yield improvement

• Experience with technical competencies for different singulation technologies: Blade dicing and saw singulation, Tape-based package singulation, Tapeless package handling and singulation, UV and IR laser processes, Stealth and advanced laser dicing technologies as well as Multi-package and panel-level singulation strategies

• Experience working with major singulation equipment suppliers and laser technology providers is an added advantage

• Strong technical leadership and influence without direct authority

• Good in strategic thinking and technology roadmap planning

• Excellent problem-solving and analytical skills

• Strong stakeholder management and communication capabilities

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

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