SoC High-Speed Interface Architect

Our Automotive Microcontroller R&D team is looking for an experienced SoC High-Speed Interface Architect to join the Chip-Level Architecture team and own the chip-level integration architecture for high-speed interface PHYs on our next-generation automotive microcontroller platform. This is an SoC architecture role — not an IP design role — focused on how high-speed PHYs land on the chip, meet electrical constraints, and integrate with the platform.

Your role

Key responsibilities in your new role

• Own the SoC-level integration architecture for high-speed interface PHYs (LPDDR, Ethernet PHY, HSPHY) — defining placement strategy, power delivery, reference clock assignment, and electrical compliance requirements.

• Define and maintain the chip-level interface specifications that high-speed PHY IP teams must comply with, including jitter budgets, termination requirements, and signal integrity constraints.

• Serve as the primary SoC architecture interface to PHY IP teams and external PHY vendors — driving integration feasibility assessments and resolving chip-level signal integrity issues.

• Perform or oversee early signal integrity simulation and parasitic analysis for high-speed interface regions of the chip.

• Review and provide architectural sign-off on PHY IP integration results, floorplan proposals, and high-speed IO region design decisions.

• Maintain technical architecture documentation in compliance with ISO 26262 requirements.

• Drive datasheet content for high-speed interface electrical parameters in collaboration with IP teams and customers.

Your profile

Qualifications and skills to help you succeed

• Bachelor's or Master's degree in Electrical Engineering or related field.

• At least 10 years of industry experience in semiconductor development with proven experience in high-speed interface architecture or integration.

• Strong knowledge of high-speed interface PHYs — LPDDR memory PHY, Ethernet PHY, and high-speed serial interfaces (HSPHY/SerDes).

• Experience with chip-level signal integrity, jitter budgets, and eye diagram analysis for high-speed interfaces.

• Understanding of PHY placement constraints, power delivery requirements, and reference clock architecture for high-speed interfaces.

• Familiarity with IO ring architecture and ESD protection strategy at high-speed IO boundaries.

• Familiarity with ISO 26262 documentation standards.

• Pro-active collaborative attitude with strong communication skills in a global multi-cultural team.

• Fluent English required; German is a plus.

You are best equipped for this task if you have:

• Owned chip-level integration architecture for LPDDR, Ethernet PHY, or high-speed SerDes in a previous SoC program.

• Defined jitter budgets, power delivery specs, and placement constraints for high-speed PHYs at the SoC level.

• Worked with PHY IP vendors to establish interface specifications, simulation models, and integration acceptance criteria.

• Experience distinguishing SoC-level integration constraints from IP-internal design decisions — and driving the former without dictating the latter.

• Contributed to datasheet electrical parameters for high-speed interface sections.

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