Senior, Expert
Lead Principal Engineer Package Definition
Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key working partner for FE colleagues for new FE technology.
Your role
Key responsibilities in your new role
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PBC and TPC assessment.
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Driver of Package Technology DFMEA Process of Record.
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Owner of Risk Interaction assessment and mitigation work packages.
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Integration of unit processes (BOM and Process) in package platform -Risk assessment, study interaction with other processes, process flow.
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Working partner for FE in FE/BE interaction and integration topics.
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Support Pre development for new Chip technology.
Your profile
Qualifications and skills to help you succeed
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Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics) with 10 years of working experience in IC/semiconductor environment SMT, Semiconductor Packaging, Assembly and Test knowledge.
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Good aptitude for communication, collaboration, negotiation and solution finding.
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Knowledge of FE/BE and BE/BE Interaction.
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Knowledge of 8D & T6s methodology.
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Knowledge of DFMEA/PFMEA.
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Knowledge of Internal Package analysis/ first level reliability.
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