Engineer / Senior Engineer Reliability (Advanced Packaging Technologies / Surface Mount Technology)

The Engineer Reliability will be responsible for developing and executing reliability assessment strategies for new semiconductor package technologies, identifying and mitigating risks, supporting qualification activities, and collaborating with cross-functional teams to ensure package reliability meets customer and industry requirements.

Your role

Key responsibilities in your new role

• Define a reliability assessment plan for new package technologies using a failure mechanism-based approach and determine the technical capability of package technologies to meet specified reliability requirements, including the setup of customer mission profiles.

• Identify new failure modes, detect unexpected results and statistical outliers, and assess potential risks that are not covered by existing standards.

• Execute reliability stress tests and physical analyses, evaluate reliability data, and derive conclusions and recommendations.

• Participate in project discussions related to package delta analyses and risk assessments.

• Support the qualification of new packages, processes, and production changes.

• Evaluate and qualify chip embedding packages and high-density power modules for AI-applications.

• Generate and establish work-instructions for physical failure analysis.

• Make sure to follow the current and agreed reliability standards (mainly industrial).

Your profile

Qualifications and skills to help you succeed

• Minimum Bachelor's or Master's degree in Materials Science, Physics, Electrical Engineering, or Electronics Engineering.

• Minimum 1-3 year of experience in the frontend or backend semiconductor manufacturing industry. Experience in reliability and qualification activities is preferred.

• Ability to work independently, take a proactive approach, and drive value through continuous improvement initiatives.

• Strong team player with excellent communication and interpersonal skills.

• Familiarity with problem-solving techniques, statistical analysis, Failure Mode and Effects Analysis (FMEA), Python programming, and Tableau is an advantage.

• Experience in advanced packaging technologies (e.g., chip embedding) or Surface Mount Technology (SMT) is an added advantage.

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

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Carol Lee