Your Role

Key responsibilities in your new role

• Responsible for outsourced package platform qualification (lead and follower products) and process optimization at subcons to meet the time-to-market, product quality level, process capability and assembly yield target

• Responsible for package definition tasks in OSAT segment in defining project complexity definition with Delta assessment list, project category assessment, and perform project risk assessment with mitigation actions

• Responsible for integration of unit processes till process freeze for assembly and test at subcons which entails creating assembly specification, marking instruction, and packing specification for upload into Database

• Apply and verify design rules based on established baseline document as well as specific equipment and process capability of specific assembly sites. This includes OSATs technical capability assessment support role

• Define process and select Bill of Material as needed to meet MSL, reliability level, and other specific package requirements for development and pre-development

• Responsible for enabling of new package platform and derivatives packages, and support of technology and package development at OSAT. This includes new subcon enabling support role

• As a driver or co-driver for platform related Task force activities, and has ability to drive for technical problem-solving

Your Profile

Qualifications and skills to help you succeed

• Master or Bachelor degree in Engineering disciplines

• Minimum 10 years’ working experience of package development in new product introduction or process (Pre-assembly, assembly and test) and 3 years in supporting project management

• Experience in Module assembly, Wafer level package (WLP), bumping, eWLB, and System in Package (SiP) will be a key advantage

• Good knowledge of process and material in both laminates and lead frame packages and interaction to the different functions (laminate/lead frame design, design rules, process)

• Good understanding of quality requirements/release criteria (e.g JEDEC/AEC grade) that fits and match to product/package design and BOM sets selection

• Strong analytical skills, ability to deal with conflict. Live up to high quality standards. Good quality mind-set and excellent problem-solving

• Demonstrates active knowledge transfer and best practice sharing across organizational boundaries, be ambitious and ability to make timely decision

• Highly motivated with the ability to prioritize, perform under pressure, and get team members and stakeholders involved and to motivate them

• Ability to collaborate and work as a team with various stakeholders and partners in multi-site/multi-cultural teams

• Strong in communication and people interpersonal skills across all levels. Experience in Subcon management

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.