Staff ENGINEER, HIG HBM-ARCHITECTURE

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines!

As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams.

Responsibilities:

• Define and implement end-to-end DFT architectures for HBM base die and DRAM die

• Develop DFT strategies for stacked-die, cube-level, and system-level test flows

• Architect test access mechanisms supporting wafer probe through final test

• Enable silicon observability for yield learning, debug, and failure analysis

• Collaborate across design, verification, layout, test, and manufacturing teams

• Leveraging AI for design quality improvement and DFT

Minimum Qualifications:

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field

• Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts

• Experience with wafer probe and final test semiconductor flows

• 5+ years of experience in DRAM or ASIC DFT design or verification

Preferred Qualifications:

• Experience with HBM, DRAM, or advanced memory products

• Knowledge of TSV-based 3D integration and stacked-die test challenges

• Hands-on experience with at-speed test or advanced DFT techniques

• Exposure to DFT security features or custom customer test interfaces

• Prior experience using AI to improve DFT coverage is higher desiired

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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