Principal HIG ESD and Latch-up Engineer- HBM - TPG

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are part of Micron’s HBM Design Architecture organization, where we push the limits of memory technology every day. Our team works across global, multicultural engineering groups to build next-generation HBM solutions that power AI and machine learning. We believe the best ideas come from collaboration, curiosity, and a shared drive to innovate!

This role plays a critical part in ensuring the reliability of Micron’s most advanced DRAM and HBM products. As an ESD & Latch Up Engineer, you will shape protection strategies from early design through high-volume manufacturing, working hands-on with silicon, layout, and foundry partners. If you enjoy solving deep technical problems and influencing product robustness at scale, this role offers both impact and growth. This role supports the design and deployment of AI-enabled solutions that improve efficiency and decision-making.

Responsibilities:

• Define and own chip-level and IP-level ESD and latch up strategies for HBM DRAM, base die, I/O, TSVs, and die-to-die interfaces

• Establish ESD and latch up requirements, targets, and sign-off criteria aligned with JEDEC/ESDA standards

• Enable ESD protection circuits and latch up safe layout practices across designs and technologies

• Lead silicon validation, failure analysis, and correlation of pre-silicon assumptions to silicon results

• Act as the technical interface to foundries and partner closely with design, packaging, reliability, and product teams

Minimum Qualifications:

• Master’s degree or Ph.D. in Electrical Engineering or equivalent industry experience

• Strong fundamentals in ESD physics, latch up mechanisms, and advanced CMOS devices

• Hands-on experience with ESD protection circuits and latch up prevention techniques

• Familiarity with JEDEC and ESDA standards, including HBM, CDM, and JESD78

Preferred Qualifications:

• Experience supporting ESD and latch up sign-off for advanced DRAM or HBM products

• Knowledge of SCR-based clamps, distributed ESD networks, and rail-based strategies

• Experience working directly with foundry ESD and latch up teams

• Proven ability to mentor engineers and influence design methodology across teams

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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