OUR STORY

At ST, we believe in the power of technology to drive innovation and make a positive impact on people, business, and society. We are a global semiconductor company, and our advanced technology & chips forms the hidden part of the world we live in today.

When you join ST, you will be part of a global business of more than 115+ nationalities and present in 40 countries, 50,000+, diverse and dedicated creators & makers of technology around the world!

Developing technologies takes more than talent: it takes amazing people who understands collaboration and respect. People with passion and desire to disrupt the status quo, push boundaries and drive innovation – whilst unlocking your own potential.

YOUR ROLE

This position will closely cooperate with OSAT, Division and R&D team, mainly focusing on new product development and smooth production

• Deploy technical requirements on new subcontractors

• Define critical process characteristics with subcons to fit product characteristics defined by internal customers

• Yield improvement and process improvement projects

• Involve in package maturity (NPI)

• Involve in automotive readiness project

• Develop workable system and template (when there is no ST format)

• Deploy ST technical projects (Inkless Map, STIF, ULT)

• Manage change management

• Package roadmap benchmarking

YOUR SKILLS & EXPERIENCES

• Bachelor's degree or above

• 8 years relevant experience in Semiconductor

• Proficient in Semiconductor assembly processes

• Experienced in APQP, SPC, FMEA, DOE, 8D, SPC, etc

• Good problem solving, statistical analyst and project management skills

• Able to manage complex technical problems independently

• Good communication skills in both verbal and written English

• Experienced in MS software

Working at ST means innovating for a future that we want to make smarter, greener, in a responsible and sustainable way. Our technology starts with you. Join us and start the future!

To discover more, visit st.com/careers