Principal Engineer, Package Silicon Integration

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

In this role, you will drive silicon and package integration strategies within Micron’s Package Development Engineering team. You will partner with global engineering teams, including Package Design, Chip Package Interaction (CPI), Product Development Engineering, Fab Technology Integration, Substrate Technology, Technical Program Management, and Quality & Reliability, to deliver high-quality, innovative products.

You will develop technical roadmaps, define and maintain CPI package design guidelines, provide technical feedback on reliability and electrical validation plans, and establish approaches to monitor silicon integration health across the product lifecycle, from package components to modules and SSDs. Success in this role requires collaboration, technical problem-solving, and the ability to influence across multi-functional teams.

You will also use AI-enabled tools and technologies to enhance productivity, accelerate learning, streamline workflows, and support data-driven decision-making!

Responsibilities Include

• Develop systems/methods for monitoring E2E CPI health, collaborating with internal teams and using capability of AI tools

• Lead CPI package design rules in the package design rule management system and maintain design rule manuals for flip chip, wire bond, and 3DS packages

• Create and maintain technology roadmaps and present as needed

• Support CPI test vehicle development and reliability characterization efforts as needed

• Collaborate with CPI engineering, package design, Fab BEOL process integration, development product engineering, and global quality to identify NUDDs and potential failure mechanisms, provide CPI risk assessments, and provide CPI risk mitigation solutions.

• Create AI agents and compiling summaries from diverse data sources

Required Qualifications:

• Bachelor’s degree or higher in Materials, Mechanical, Chemical, or Electrical Engineering.

• 5+ years of relevant industry experience

• Experience with chip package interactions and 1st level chip interconnect reliability

• Experience with component package materials & BOM selection and package assembly

• Excellent communication skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners.

Preferred Qualifications:

• Experience with NAND/DRAM memory assembly, design, and CPI failure mechanisms

• Knowledge of DRAM/NAND Fab BEOL processes & packaging interactions impacting device quality and reliability performance

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

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