Principal Analog Design Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability.

As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions.

Responsibilities will include, but are not limited to:

• Lead the design and own critical HBM analog circuits, including:

  • High‑speed transmitters and receivers
  • Clock generation and distribution (PLLs, DLLs, CDRs)
  • SerDes‑related analog blocks
  • Biasing, reference, and calibration circuits
  • Power delivery and regulation circuits (LDOs, regulators)

• Define and manage IP interfaces, power domains, clocking schemes, and reset strategies across subsystems

• Perform detailed pre‑layout and post‑layout simulations

• Conduct PVT, Monte Carlo, mismatch, and aging analyses

• Work closely with layout engineers to define floorplanning and symmetry requirements, ensure matching, shielding, and EM/IR compliance

• Review and sign off on analog layouts

• Drive layout‑aware design optimizations for advanced nodes

• Define best practices for analog design, documentation, and reuse

• Collaborate across analog, digital, system, packaging, and test teams

Minimum Qualifications:

• MS or PhD in Electrical Engineering or related field

• ~10–15+ years of experience in analog/mixed-signal IC design

• Proven expertise in:

  • High-speed interface design
  • Clocking circuits (PLL/DLL/CDR)
  • Power management circuits

• Strong experience in:

  • Analog IP integration at subsystem or SoC level
  • SPICE simulation, extraction, and modeling
  • Silicon bring-up and lab validation

• Deep understanding of:

  • Advanced CMOS processes
  • Noise, jitter, SI/PI, and cross-domain coupling effects

Preferred Qualifications:

• Deep knowledge of DRAM sub‑system architecture, specification, operation, or design.

• Understanding of Physical Layout & Circuit Floor Planning

• Excellent Problem‑Solving & Analytical Skills

(LLM)

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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