Senior Process Engineering Technical Leader

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Advanced Packaging Technology Development is where Micron pushes the boundaries of 3D memory. We take ideas from early experiments to factory‑ready processes, working hands‑on with materials, tools, and partners across the industry. If solving foundational problems that shape future products excites you, you’ll feel right at home here!

This role is a senior Process Engineering Technical Leader focused on chip‑to‑wafer and hybrid bonding. You’ll lead the development and scale‑up of bonding processes that enable high‑performance 3D memory products like HBM and 3DS DRAM. Your work will span early pathfinding through high‑volume manufacturing, with a clear impact on reliability, performance, and cost.

Responsibilities:

• Set technical direction for chip‑to‑wafer and hybrid bonding processes across development programs

• Develop and mature process flows, materials, and integrations that meet performance, reliability, and cost needs

• Lead problem solving across wafer fab, die processing, bonding, thinning, and downstream packaging interactions

• Partner with integration, equipment, product, manufacturing, and quality teams to deliver TD breakthroughs

• Drive technology transfer into manufacturing with a focus on repeatability and high‑volume readiness

Minimum Qualifications:

• Master’s degree or PhD in Materials Science, Electrical, Mechanical, or Chemical Engineering, or a related field

• 13+ years of semiconductor R&D experience, including 10+ years in advanced packaging

• Proven ability to lead multi‑team technical efforts and drive decisions without formal authority

Preferred Qualifications:

• Experience leading FOAK process or equipment development under technical uncertainty

• Hands‑on work with equipment and materials suppliers shaping next‑generation capabilities

• Demonstrated technical leadership through mentoring, methodology development, patents, or publications

• Deep expertise in bonding processes such as solder reflow, TCB, and hybrid bonding

• Strong understanding of process and package integration and cross‑module interactions

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

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