Principal Engineer Advanced Package Technology Development

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Job summary

As a Principal Engineer within Micron’s Advanced Package Technology Development team, you will play a key role in driving innovation through strategic, industry‑informed leadership. Based at the Boise campus, you will shape advanced packaging technology roadmaps and investment priorities by applying deep technical expertise alongside rigorous cost and value analysis, enabling well‑balanced trade‑off decisions across performance, scalability, and total cost of ownership. Working in a highly collaborative, dynamic environment, you will influence solutions aligned with Micron’s business objectives, contributing directly to increased revenue, long‑term strategic success, and the development of leading‑edge packaging technologies.

Responsibilities

• Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.

• Collaborate continuously with internal and external partners to ensure seamless technology integration.

• Consult and influence technical and strategic decisions at senior management levels.

• Analyze and understand competitive trends to improve Micron’s competitive edge.

• Guide the development of packaging technology roadmaps.

• Assess competitive metrics through data intelligence for strategic advantage.

• Define requirements with proven technical data and content..

• Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.

Minimum Qualifications

• Over 5 years of professional experience in semiconductor advanced packaging.

• BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field, or equivalent experience.

• Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding (Required).

• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process (Required).

• Experience in DRAM manufacturing and OSAT companies (Required).

Preferred Qualifications

• Understanding of DRAM wafer structure and process flows (Highly Preferred).

• Proficient in English, with additional language skills in East Asian languages being highly preferred.

• A passion for innovation demonstrated by patent inventions or published literature!

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

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