Poly Etch Process Engineer

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential. Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

• Manage a cost-effective wafer fabrication process by providing engineering support to the production line to achieve the organization’s targeted manufacturing performance. Take full ownership of all engineering issues for the assigned process.

• Maintain and support day-to-day manufacturing activities through real-time problem analysis and timely implementation of effective solutions.

• Ensure smooth process flow with high quality, high yield, and low cost by working closely with Maintenance Specialists, Production Supervisors, and Shift Engineers to achieve committed targets.

• Provide cross-functional, cross-department, and cross-fab support based on operational needs and priorities.

• Train new engineers and share technical knowledge to support team development.

• Support shift operations as needed and return to normal shift assignment for process/project work when assigned.

• Take responsibility for trench etch processes within the poly team.

YOUR SKILLS & EXPERIENCES

• Bachelor’s degree in Electrical/Electronics Engineering, Mechanical Engineering, Materials Engineering, Chemical Engineering or a related discipline.

• Around 2 years of experience with trench etch processes and the associated challenges, including profile control and process stability.

• Ability to conduct real-time problem analysis for SPC OOC/OOS, defect failures, and FDC failures, and determine appropriate solutions by working with all relevant stakeholders.

• Ensure all basic inline investigations are reported in real time to the relevant owners with complete and accurate details.

• Ability to set up process recipes for newly introduced processes.

• Ability to establish a robust process control system to maintain the lowest possible Wafer at Risk (WAR) level, maximize the signal-to-noise ratio for SPC and FDC, and minimize human dependency.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.