Integrated Circuit Packaging Architect

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The Role: Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications. Successful candidate would lead cross functional teams across geos in designing and developing novel package architectures and processes. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions.

The Person: The candidate should have a proven track record of driving technology development in semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management

Responsibilities:

• Work with product architects in early definition stage to understand and define package architectures, roadmap

• Lead new package technology development initiatives from concept to full technology qualification

• Drive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelines

• Establish Yield roadmap and lead implementation of yield, data analytic tools as need

Preferred Experience:

• Experience in semiconductor technology development role

• Experience working with manufacturing partners such as suppliers, OSATs and foundry partners.

• In-depth knowledge in material science, thin film process development, and/or packaging

• Experience in a leadership role driving cross-functional teams

• Proven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment

Education: BS/MS/PhD in Material Science, Mechanical Engineering, Computer Science, Applied Mathematics, Electrical Engineering or equivalent

This role is not eligible for visa sponsorship.

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*Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.