Backend Process Engineer

Location: Alhambra, CA

Position Summary: The Backend Process Engineer – InP Wafer Fab position is responsible for development, optimization, and manufacturing support of backend wafer fabrication processes for Indium Phosphide (InP)–based photonic devices, including DFB lasers, Semiconductor Optical Amplifiers (SOAs), and Gain Chip products. This role provides technical ownership of critical backend modules including wafer lapping/thinning, n-side metallization, rapid thermal annealing (RTA), and automated optical inspection (AOI). The position also supports singulation, optical coatings, reliability readiness, and packaging interfaces, with a strong focus on yield, defect reduction, and manufacturing stability.

Responsibilities:

Backend Process Ownership and Optimization (35%):

• Own and optimize backend wafer fab processes including lapping/thinning, n-side metallization, and RTA

• Establish robust process windows, recipes, and control limits for backend modules

• Maintain stable manufacturing performance through continuous monitoring and improvement

Yield Improvement, Defect Reduction, and AOI Control (25%):

• Own and maintain AOI processes for backend defect detection and yield monitoring

• Drive singulation yield improvement and defect reduction through data analysis and root-cause investigations

• Analyze inline and post-process data to identify trends and systematic issues

• Implement corrective and preventive actions and verify effectiveness

Singulation, Optical Coatings, and Packaging Interface Support (20%):

• Support cleaving, dicing, and singulation processes to ensure device integrity

• Provide process engineering support for AR/HR optical coatings and vendor qualifications

• Collaborate with packaging, device, and reliability teams to ensure packaging readiness

New Product Introduction and Technology Support (10%):

• Support new product introduction (NPI), process transfers, and technology changes

• Evaluate backend process risks associated with new designs, materials, and device structures

Documentation, Process Control, and Manufacturing Support (10%)

• Author and maintain SOPs, travelers, process specifications, and control plans

• Define SPC metrics and control strategies for backend processes

• Provide hands-on manufacturing and troubleshooting support as needed

Minimum Qualifications:

• Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or a related field

• Minimum of 3+ years of experience in backend semiconductor processing

• Hands-on experience with lapping/thinning, metallization, and thermal processes

• Understanding of InP-based or III-V compound semiconductor wafer fabrication processes

• Experience with AOI systems, yield analysis, and data-driven process improvement

• Strong understanding of singulation, packaging interfaces, and reliability requirements

• Proficiency in SPC, DOE, and statistical analysis

• Ability to work across cross-functional manufacturing and engineering teams

• Preferred experience with InP or III-V optoelectronic devices

• Familiarity with AR/HR optical coating processes

• Experience supporting high-mix, low-volume manufacturing environments preferred

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description.

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities.

A reasonable estimate of the pay range for this position is $100,000 - $135,000. There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package.

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